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Microcontrollers and Processors, Video and Image Compression, Data Compression, Interconnects and Interfaces , Peripherals and Controllers , Security
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ASIC design and supply, IC design services , ASIC business case validation, Sensor/MEMS interfacing, Power management, High-Performance and low power, High-voltage design, Test and packaging, Industrialisation, Supply Chain Management, Functional safety
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0.4V Standard Cell Library for 22FDX (22nm FDSOI), Adaptive Body Bias Solution for 22FDX (22nm FDSOI)
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SARADC – 37.5 MS/s 12 bit SAR ADC, SARADC – 2MS/s 14 bit SAR ADC w/o Calibration, LLSDADC – High Resolution Low Latency ΣΔ ADC, SDCRDAC – 24 bit Sigma-Delta DAC, CRDAC – 12 bit charge-redistribution DAC, FIRDAC – High Accuracy Low OOBN ΣΔ DAC
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Test Design & Development, Probe Card & Loadboard Design and Fabrication, Socket & Pin Solutions, High Volume/Low Mix or High Mix/Low Volume Testing, Backend AOI, Bake & Pack Services, IR4.0 Smart System Automation
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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Analog and Mixed-Signal Circuits, Digital Systems and Data Processing, Wireline Communications, Radio Frequency Integrated Circuits, ASIC Foundry Services, Integrated Sensor Systems
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TRNG IP Cores, SHA3 IP Cores, RSA Keygen IP Cores, RSA IP Cores, ECDSA IP Cores, DRBG IP Cores, AES GCM IP Cores, MIL-STD-1553-IP CORE, ARINC664 END SYSTEM IP CORE, ARINC664 SWITCH IP CORE, ARINC429 IP CORE, PRACH IP Suite
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RTL Design, RTL Design Verification, DFT, Netlist to GDS, Analog Circuit and Layout, Post Silicon Services
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Physical Design, STA & Synthesis, Flow Development, RTL Design & Integration, DFT, Design Verification, Circuit and Layout Design, Turnkey Solutions / IP Services
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ASIC Design, Test and Characterization, Methodological support for IC designers, fabs, and IP vendors, Laboratory Equipment
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CoreVCO, CorePLL, CorePLL6G, CoreADC, CoreDCDC, Antenna switch, Antennas, CoreHW IPs
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Supply Chain Management Services – Turnkey Solutions, Engineering services, test program development, Qualification & Reliability investigations, Optomechanical qualifications, Failure & Technological analysis, Device testing, device programming, end-of-line services
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Mixed Signal CMOS, Rad-Hard Microelectronics, Power Management Discretes and ICs, Interposers & Advanced Packaging Solutions, Custom Foundry Solutions
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Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design
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